| PART |
Description |
Maker |
| 319FS134XMT18B 319FB134XMT18B 319FA134XMT18B 319FS |
Composite EMI/RFI Ultra Low-Profile Shield Sock
|
Glenair, Inc.
|
| 319HT134XM08P 319HT134XM10P 319HT134XM12P 319HT134 |
Composite EMI/RFI Ultra Low-Profile Shield Sock
|
Glenair, Inc.
|
| 0900590014 90059-0014 |
2.54mm (.100) Pitch C-Grid? Micro Shunt, Low Profile, 4mm Gold Plating
2.54mm (.100) Pitch C-Grid庐 Micro Shunt, Low Profile, 4mm Gold Plating
MOLEX Connector
|
Molex Electronics Ltd.
|
| 0900590011 90059-0011 |
2.54mm (.100) Pitch C-Grid? Micro Shunt, Low Profile, 15mm Select Gold (Au) with Gold (Au) Flash Plating
2.54mm (.100) Pitch C-Grid庐 Micro Shunt, Low Profile, 15mm Select Gold (Au) with Gold (Au) Flash Plating
MOLEX Connector
|
Molex Electronics Ltd.
|
| 0900591009 90059-1009 |
2.54mm (.100) Pitch C-Grid? Micro Shunt, Low Profile, 15mm Select Gold (Au) with Gold (Au) Flash Plating
2.54mm (.100) Pitch C-Grid庐 Micro Shunt, Low Profile, 15mm Select Gold (Au) with Gold (Au) Flash Plating
MOLEX Connector
|
Molex Electronics Ltd.
|
| 0900591020 |
2.54mm (.100) Pitch C-Grid? Micro Shunt, Low Profile, Black Housing
MOLEX Connector
|
Molex Electronics Ltd.
|
| 447AS327XM08 447FS327XM08 447LS327XM08 447SS327XM0 |
Composite Standard Profile EMI/RFI Banding Backshell with Qwik-Ty垄莽 Strain Relief
Composite Standard Profile EMI/RFI Banding Backshell with Qwik-Ty? Strain Relief
|
Glenair, Inc.
|
| 507T088XM51B04 507S088XM51B04 507E088XM51B04 507T0 |
Micro-D Backshells EMI, Composite, Round Cable Entry 507-088
|
Glenair, Inc.
|
| 0900590013-17 |
2.54mm Pitch C-Grid Micro Shunt, Low Profile, 0.889μm Pre-tinned Plating
|
Molex Electronics Ltd.
|
| IHLP2020BZER4R7M11 IHLP2020BZER1R0M01 IHLP2020BZER |
General Fixed Inductor, 1 ELEMENT, 4.7 uH, COMPOSITE-CORE, GENERAL PURPOSE INDUCTOR, SMD, CHIP, 2020, HALOGEN FREE AND ROHS COMPLIANT
General Fixed Inductor, 1 ELEMENT, 1 uH, COMPOSITE-CORE, GENERAL PURPOSE INDUCTOR, SMD, CHIP, 2020, GREEN
General Fixed Inductor, 1 ELEMENT, 2.2 uH, COMPOSITE-CORE, GENERAL PURPOSE INDUCTOR, SMD, CHIP, 2020, GREEN
IHLP-2020AB-01 3.3 20% ER E3 - Cut TR (SOS)
IHLP-6767DZ-01 3.3 20% EB E3 - Bulk
IHLP-6767DZ-01 8.2 20% EB E3 - Bulk
IHLP-6767DZ-01 .82 20% EB E3 - Bulk
General Fixed Inductor, 1 ELEMENT, 10 uH, COMPOSITE-CORE, GENERAL PURPOSE INDUCTOR, SMD, CHIP, 2020, HALOGEN FREE ROHS COMPLIANT
General Fixed Inductor, 1 ELEMENT, 2.2 uH, COMPOSITE-CORE, GENERAL PURPOSE INDUCTOR, SMD, CHIP, 3232, GREEN
General Fixed Inductor, 1 ELEMENT, 2.2 uH, GENERAL PURPOSE INDUCTOR, SMD, CHIP, 2726, GREEN
General Fixed Inductor, 1 ELEMENT, 1.5 uH, GENERAL PURPOSE INDUCTOR, SMD, CHIP, 2726, GREEN
IND HIGH CURRENT SHLD 33UH 20% 100KHZ 5050 - Tape and Reel
General Fixed Inductor, 1 ELEMENT, 2.2 uH, COMPOSITE-CORE, GENERAL PURPOSE INDUCTOR, SMD, CHIP, 5050, ROHS COMPLIANT
General Fixed Inductor, 1 ELEMENT, 5.6 uH, COMPOSITE-CORE, GENERAL PURPOSE INDUCTOR, SMD, CHIP, 5050, ROHS COMPLIANT
General Fixed Inductor, 1 ELEMENT, 4.7 uH, COMPOSITE-CORE, GENERAL PURPOSE INDUCTOR, SMD, CHIP, 5050, ROHS COMPLIANT
IHLP-2525CZ-5A Low Profile, High Current IHLP® Inductors
General Fixed Inductor, 1 ELEMENT, 2.2 uH, COMPOSITE-CORE, GENERAL PURPOSE INDUCTOR, SMD, CHIP, 2020, HALOGEN FREE AND ROHS COMPLIANT
|
Vishay Dale
|
| 614-91-304-31-012 614-93-304-31-012 614-99-304-31- |
Dual-in-line pin carrier assemblies Low profile / low profile ultra thin Solder tail
OSCILLATORS 50PPM 0 70 3.3V 4 18.432MHZ TS HCMOS 5X7MM 4PAD SMD 双列直插脚载波组件低轮廓/低调超薄焊尾
CONNECTOR ACCESSORY 双列直插脚载波组件低轮廓/低调超薄焊尾
Dual-in-line pin carrier assemblies Low profile / low profile ultra thin Solder tail 双列直插脚载波组件低轮廓/低调超薄焊尾
|
TE Connectivity, Ltd.
PRECI-DIP SA
PREDIP[Precid-Dip Durtal SA]
|
|
